The date of registration : 2010.07.28
| First Name | **** | Last Name | **** |
|---|---|---|---|
| Gender | **** | Date of Birth | **** |
| **** | Nationality | China | |
| Street Address | **** | ||
| City | Singapore | Country | Singapore |
| Objective | Engineer | ||
| Salary Expectation | (USD) 60000 / year | ||
| Primary Contact Number |
****-**** | Secondary Contact Number | ****-**** |
|---|---|---|---|
| Field Desired | Materials Engineers | ||
| Keyword Search | Material Science,Microelectronics,Chemical Engineering,Polymer | ||
| Preferred Location | 1st : None | 2nd : | 3rd : |
| Languages Spoken | English(Fluent) | Chinese( Native) | |
| From - To (mm/yyyy) |
Employer | Position | ||
|---|---|---|---|---|
01.2010 ~ 07.2010 |
Company Name | Stats Chippac | Title | Senior Process Engineer |
| Categories | Materials Engineers | |||
| Country | Singapore | |||
| Reason For Leaving | ||||
| Detailed Explanation | 1. Project leader for troubleshooting process issues resulting yield loss;
2. Program management for yield improvement activities |
|||
03.2007 ~ 12.2009 |
Company Name | Cabot Microelectronics Singapore Ltd | Title | Research Scientist |
| Categories | Materials Engineers | |||
| Country | Singapore | |||
| Reason For Leaving | ||||
| Detailed Explanation | 1. Research, formulation and characterization of CMP slurries with nano particles for magnetic head wafer and hard disk media polishing
2. Technical support to customers for new products qualification and process trouble-shooting; |
|||
10.2001 ~ 02.2007 |
Company Name | Advanpack Solution Pte Ltd | Title | Assistant Manager of Material development |
| Categories | Materials Engineers | |||
| Country | Singapore | |||
| Reason For Leaving | ||||
| Detailed Explanation | 1. Leading a group of engineers and technicians for research, formulation and characterization of thermal-cured epoxy underfill, wafer level coating and flux materials for flip-chip, chip-scale package and BGA application;
2. Process feasibility evaluation and flip-chip assembly reliability evaluation of all developed new materials; 3. Technical support to customers on new material evaluation/process qualification and potential customer engagement. 4. Knowledge of wafer bumping methodology and process |
|||
08.1994 ~ 07.1997 |
Company Name | Chinese Academy of Science | Title | Research Assistant |
| Categories | Other Teachers and Instructors | |||
| Country | China | |||
| Reason For Leaving | ||||
| Detailed Explanation | 1. Assisting in laboratory setup and instruments management;
2, research focused on the synthesis and characterization of the new polymer-metal complexes and their catalytic behaviors |
|||
| School Name | Graduation Date (mm/yyyy) |
Continent/Country | Major | Degree |
|---|---|---|---|---|
| National University of Singapore | 01.2001 | SINGAPORE | Chemical Engineering | PhD. |
| Beijing Institute of Technology | 07.1994 | CHINA P. R. | Chemical Engineering | B.S/B.A |
| Technical Skills | Certificate Of Qualification | Level | Date |
|---|
| Special Skills Or Training |
1. Formulation:
- Years of hands-on experiences on epoxy materials formulation for microelec tronics packaging by screening/optimizing compositions of resins, additive s and fillers; - Expertise in formulation of nano particle based (colloidal silica and alum ina particles) slurries for magnetic head wafer and hard-disk substrate po lishing by screening/optimizing particles and chemicals 2. Material characterizations: - Years of hands-on experiences on materials characterization, including pol ymers, fine chemicals and inorganics; - Expertise in characterization on thermal and mechanical properties of poly meric materials by DSC, TMA, TGA, Instron Tester, Rheometer, etc.; - Expertise in characterization on nano particles such as colloidal silica a nd alumina particles by particle size and zeta potential measurement 3. Surface analysis: - Excellent hands-on experience in surface-interface analysis by means of XP S, AFM, SEM-EDX, etc.; proficiency in result interpretation. 4. Analytical chemistry: - Well-trained in using various modern and classical chemical analysis techn iques, especially in analysis with GC, GC-MS, FT-IR, UV, etc.; 5. Process development: - New materials evaluation on microelectronics packaging processes, includi ng flip-chip assembly, BGA ball attach, SMT hybrid module, wafer-level CS P, etc.; - Hands-on experience on assembly reliability test and assembly failure ana lysis by various analytical equipment, such as Sonoscan C-SAM, DAGE Shea r tester, etc.; - Wafer CMP process optimization |
|---|---|
| Cover Letter | |
| Expiration Date | 2011.12.31 |